Technology
Xiaomi debuts 18 Fold at IFA with in-house XRing O3 chip
Xiaomi showcased its wider, passport-styled 18 Fold foldable behind glass at IFA 2026, confirming a September debut powered by its custom XRing O3 processor.
Xiaomi showcased its wider, passport-styled 18 Fold foldable behind glass at IFA 2026, confirming a September debut powered by its custom XRing O3 processor.